 |
|
 Features |
|
Epoxy-denatured polyamide base bonding layer. |
|
|
The least characteristic changes in the washing
process. |
|
|
Uniform surface smoothness facilitates array
winding. |
|
| Heating
Temp : |
|
150 170 |
| Applicable
standards : |
|
Up to the standard of JIS C 3202 "Self-bonding
polyurethane enameled round copper winding wires" |
| Applications
: |
|
Hollow coils for D.D. motors, core-wound
motors. |
|
| Range
of manufacture (Case of combination with SF.EIW) |
|
|
Code |
|
Media
of Fusion |
|
Range
of Manufacture (mm) |
|
|
| Solvent |
|
Hot
Air |
|
Elec.Current |
|
Class
0 |
|
Class
1 |
|
Class
2 |
|
Class
3 |
|
|
LOCK
BS |
|
|
|
 |
|
|
|
0.10
0.55
|
|
0.07
0.55
|
|
0.06
0.55
|
|
0.06
0.30
|
|
|
|
|
|
| Normally
used to solderable polyester-imide enameled copper wire (SF. EIW). |
| UL-approved
temperature : |
|
SF.BW (155)
SF.EIW (180) |
