Contact-Probe | Wire for continuity tests on boards | Electric Wires | Products

As electronic components become more and more compact, the pitches of electrodes have become narrower, thereby necessitating contact probes that are compliant with narrower pitches.
TOTOKU developed the Needle Type Contact Probe, which is ideal for electronic components with narrow-pitch-wired electrodes through a combination of its proprietary straight suspension wire and surface treatment technologies with newly developed terminal fine-processing technology.

Structure

·The diameter of beryllium copper can be reduced to

00.05 mm.

·Patent obtained by TOTOKU for a combination of beryllium copper and urethane resin cover.

Applications

Continuity test of IC package boards

Continuity test of PC boards with narrow-pitch pattern

Continuity test of liquid crystal panels

Continuity test of various kinds of connectors

TDR test of board wiring
[Coaxial probes under development]

Measurement of Kelvin resistance of multilayer boards
(Detection of pseudo contacts)
[4-head probes under development]

Specifications

Materials

Finishing

Size

Head shape

Insulating coating

WW
  Tungsten
  JIS:H4461(VWW1E)

BeCW
  Copper beryllium alloy
  JIS:H3270(C1720W)

Nickel + Gold plate

Nickel + Rhodium plate

Diameter

0.05 mm

0.12 mm

Length
20 mm

35 mm

It responds to the
size of your hope.

Flat
Hemisphere
Cone
Cone+ Hemisphere
Cone+Flat

Fluoroplastic

Coating thickness:
0.010mm

Color:
Green,Blue,Red,Violet

Urethane resin

Coating thickness

Color : Red

Characteristics

	Material characteristics (Standard)			Electrical isolation (Standard)
Materials	Young's modulus(GPa)	Hardness(HV)	Electric resistivity(·m)	Insulating resistance(G)	Withstand voltage(V)
WW	370	700	5.510^-8	1.0 minimum at 200V	400 minimum
BeCW	120	400	7.810^-8	1.0 minimum at 200V	400 minimum